Premium Powders for Advanced Applications
Semiconductor applications have demanding and diverse requirements. 6K’s UniMelt® technology can be used to create Alumina, Silica, and Ceria based materials, as well as specialty particle coatings for CMP applications with tailored characteristics.
Characteristics inherent in powders processed in UniMelt® include high sphericity (no edges), no satellites, tight powder size distribution (no oversized particles), non-agglomerated, highly dispersed and within specified Zeta Curve parameters.
Oversized and angular powders can be a real issue in CMP applications where defects can compromise the operation of the semiconductor. Unlike fumed or batch chemical processes, the UniMelt® process does not produce angular powders during processing, and can actually densify powders, making them more efficient in their planarization.